AMAOE Tin Plating Tool, Model:X-17 CPU Set Engraving
SAR 503.78
Price excludes VAT. Shipping is calculated at checkout.
Standard Delivery
Imported through standard delivery.
Product Description
1. Designed specifically for reinstalling CPU, RAM, NAND flash memory, and other BGA-packaged chips on smartphone motherboards. 2. Built-in magnetic base securely holds the positioning plate and stencil, enabling fast and accurate chip stencil alignment. 3. Excellent high-temperature resistance, suitable for hot air gun reflow soldering. 4. Helps form uniform, rounded solder balls, reducing the risk of bridging or missing solder balls. 5. Suitable for high-volume chip refurbishment in repair shops. 6. Compact desktop design, for mobile phone repair shops and repair labs. iPhone 17 Pro , iPhone Air , iPhone 17 Pro Max , iPhone 17 , iPhone 16e , iPhone 16 Plus , iPhone 16 Pro Max , iPhone 16 , iPhone 16 Pro , iPhone 15 Pro Max , iPhone 15 Pro , iPhone 15 , iPhone 15 Plus , iPhone 14 Plus , iPhone 14 , iPhone 14 Pro , iPhone 14 Pro Max , iPhone SE 2022 , iPhone 13 Pro Max , iPhone 13 , iPhone 13 mini , iPhone 13 Pro , iPhone 12 , iPhone 12 Pro Max , iPhone 12 Pro , iPhone 12 mini , iPhone SE 2020 , iPhone 11 Pro , iPhone 11 Pro Max , iPhone 11 , iPhone XS , iPhone XS Max , iPhone XR , iPhone X
Specifications
- SKU
- EDA010215312
- Category
- Mobile Parts › Repair Tools › Stenciling Tool
- Weight
- 0.034 kg
- Delivery
- Standard delivery
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