MaAnt MY-228 Chip Cell Phone Repair Soldering BGA Flux Paste No Lead / Halogen Flux No Cleaning

Product Description

1. Environmentally friendly material, lead-free and halogen-free, less smoke and less odor 2. Bright solder joints, no resistance, non-conductive 3. Less residue, less smoke, good flow performance 4. No short circuit, no need to clean, infinite conductivity 5. Scope of use: BGA/dense pin IC/mobile phone motherboard/computer motherboard/high-precision welding, etc. 6. Weight: about 20g 7. Size: about 12.7 x 2.9cm

Specifications

SKU

TBD0606066501

Category

Home & Garden › Soldering Tools & Accessories › Soldering Paste

Weight

0.034 kg

Delivery

Standard delivery