Mr.Yang Adjustable IC Chip Degumming Station

Product Description

1. Dual-station worktable for easy adhesive removal 2. Tempered glass, high temperature resistant and easy to clean 3. Precisely adjustable clamping width, compatible with chips of various sizes 4. Suitable for adhesive removal and pin repair of BGA, CPU, IC and other components 5. Specifically designed for removing black adhesive from mobile phone CPUs, memory ICs, power management ICs and various BGA chips, cleaning solder balls and repairing pins 6. Employs a steplessly adjustable clamping structure, equipped with dual thickness limiting baffles (0.2mm / 0.4mm) and a high-temperature resistant tempered glass work panel, enabling stable chip fixation, safe adhesive removal and efficient chip refurbishment.

Specifications

SKU

EDA0102160

Category

Mobile Parts › Repair Tools › Repair Platform

Weight

0.124 kg

Delivery

Standard delivery