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    For Qualcomm PM Series Power 3 Repairman High Precision Stencils CPU BGA iC Reballing Planting Tin Plate

    SKU: EDA004463011

    SAR 20.49

    Price excludes VAT. Shipping is calculated at checkout.

    Standard Delivery

    Imported through standard delivery.

    Product Description

    1. High temperature resistance, fast and convenient 2. This stencil is easy to use no matter you are a new or expert. 3. Precise position 4. This product is small and strong 5. High success rate of planting tin,the solder balls can be formed once after you are proficient

    Specifications

    SKU
    EDA004463011
    Category
    Mobile Parts › Repair Tools › Stenciling Tool
    Weight
    0.054 kg
    Delivery
    Standard delivery

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