iPhone X 185 Degrees Accurate Rapid Stratified Disassembly Platform Motherboard Heating Table

Product Description

1. Adopting 185-degree layered process to remove the iPhone X motherboard, not only from our fine analysis of iPhone X solder paste ,but depends on the special heating design and precise temperature control of SS-T12A. 2. SS-T12A only heats the area that the iPhone X board needs to be removed to prevent improper heating. 3. Dual bayonet design ,make sure the iPhone X motherboard is stable on the stage. 4. High purity copper is used as a film to ensure uniform heat transfer and heat. 5. Note: Only for iPhone x.

Specifications

SKU

SP8641

Category

Mobile Parts › Repair Tools › Repair Platform

Weight

1.018 kg

Delivery

Standard delivery