Kaisi 4pcs Solder Paste Stencil Universal Mobile Phone BGA Reballing Stencils 55 Multi-Purpose Steel Mesh, Model: A482+A467+A508

Product Description

1. These templates can be heated for re-filling BGA unit chips, which is very simple and quick 2. It solves the problems encountered by computer maintenance engineers when using directly heated steel nets. It is durable and long-lasting 3. The success rate of tin planting is high. After proficient operation, solder balls can be formed in one go, and it is simple and convenient to use 4. High quality materials, resistant to high temperatures and wear and tear 5. Material: stainless steel

Specifications

SKU

TBD0606276401

Category

Mobile Parts › Repair Tools › Stenciling Tool

Weight

0.114 kg

Delivery

Standard delivery