Kaisi A-8 IC Chip BGA Reballing Stencil Kits Set Tin Plate For iPhone 6 Plus / 6

Product Description

1. Professional tool for mobile phones repairing. 2. Suitable for iPhone 6 Plus / 6. 3. The unique holes design makes it easier to take out the formed solder balls. 4. This stencil is easy to use no matter you are a new or expert. 5. Special design enables stencil to align with tinning position of CPU rapidly. 6. Better fit of planting tin. smooth hole wall, no residue after tin, one-time shaping of planting bal. 7. High speed CNC laser technology, precise square hole fillet, precise hole spacing design. 8. Ultra thin design, durable and wear-resistant, full of toughness, continuous bending. 9. Special steel manufacturing, high temperature resistance, no deformation.   iPhone 6 Plus , iPhone 6

Specifications

SKU

SP7728

Category

Mobile Parts › Repair Tools › Stenciling Tool

Weight

0.028 kg

Delivery

Standard delivery