MIJING Z11 Mainboard BGA Reballing Fixture Circuit Board Repair Platform for iPhone X

Product Description

Features 1. Made of high quality aluminum alloy, very good use of accurate positioning fixture. 2. It is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering. 3. Repairing problem of iPhone X processor. Installation Instructions 1. Install the iPhone X main board on the platform. 2. Cover the iPhone X BGA reballing stencil on mainboard. 3. Evenly spread tin on the cover of the reballing stencil. 4. Remove the reballing stencil cover. 5. Take out the motherboard and cooperate with the hot air gun to solidify the tin point.

Specifications

SKU

IPXG0202

Category

Mobile Parts › Repair Tools › Stenciling Tool

Weight

0.335 kg

Delivery

Standard delivery