SUNSHINE LS2 MINI Mobile Phone Repair Non-Standard Motherboard Heating Table Supports Layered Bonding Tin Plating Degumming, EU Plug

Product Description

1. Voltage: 220V 2. Power: 160W 3. Current: 0.73A/1.45A 4. Temperature setting range: 0-260 degrees Celsius 5. Working size: about 7 x 10cm 6. Size: about 10 x 12.2 x 10.2cm 7. Weight: about 250g Features: 1. Intelligent temperature control, 0-260 degrees Celsius free temperature control, precise temperature control 2. Precise positioning, suitable for mobile phone motherboards of various sizes 3. Small and light, mini and space-saving 4. Uniform heating, aluminum alloy panel design, good thermal conductivity 5. Suitable for special-shaped motherboards of mobile phones, supporting layering, lamination, tinning, glue removal, etc. 6. Three-dimensional heat dissipation shutters, upper and lower isolation of the chassis and the heating plate, multi-directional convection heat dissipation windows of the chassis, dissipation of excess heat, durable and safe 7. Three-core power cord socket, equipped with a safety fuse tube, burn-proof, insulation design to prevent leakage, protect the service life of the machine

Specifications

SKU

TBD0606084601

Category

Mobile Parts › Repair Tools › Separation Tool

Weight

0.854 kg

Delivery

Standard delivery